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Introducing patented, breakthrough technology!

This product optically measures the thickness of silicon or other materials using infrared light.

This tool can help solve your backthinned wafer yield problems or enable reduced thicknesses.

Thickness measurement range: 20 - 600 µm (config "A")
4 - 400 µm ("B")
Short-term repeatability: 1 200 nm typical
Measurement spot size: 25 µm
Measurement time: 2 s per location
Stage life: > 100 km of travel

note 1: dependent upon surface quality. 2 side polished wafers' repeatability is typically < 10 nm
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