Foothill Instruments
Film thickness metrology systems


  Software
  Production mode
  • Automatically measure multiple sites on wafer
  • One button RUN generates thickness results with statistics
  • Alerts may be defined for thickness and fit out of range condition
  • Advanced Wafermap® software for mapping and statistical process control (SPC)
production screen capture

  Semi-auto mode
  • Allow mapping with manual positioning
map screen capture

  Engineer mode
 
  • Manual site measurement
  • Pattern and film editors for production program definition
  • Sophisticated editor generates grid, ring, line, or custom patterns
  • Absolute reflectivity measurements
  • Export reflectivity and model data to text files
  • Maintenance functions
engineering screen capture
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Wafermap ©  Boin-GmbH


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