Introducing patented, breakthrough technology!
This product optically measures the thickness of silicon or other materials using
This tool can help solve your backthinned wafer yield problems or enable reduced thicknesses.
- Materials: Si, GaAs, InP, quartz, resist, ...
- Measure bumped wafers
- Measure through tape on top or bottom
- Allows conductive substrates
- 300 mm vacuum chuck
- Also available as manual positioning or as an integrated metrology tool
note 1: dependent upon surface quality. 2 side polished wafers' repeatability is typically < 10 nm
|Thickness measurement range:
||20 - 600 µm (config "A")
4 - 400 µm ("B")
|Short-term repeatability: 1
||200 nm typical
|Measurement spot size:
||2 s per location
||> 100 km of travel
© Foothill Instruments